Optoelectronic packaging is one of the current main challenges for optoelectronic device and optoelectronic integration. Among others, it comprises optical underfill compound, optical fiber array, micro lens, silicon carrier and substrate effects on the thermal, optical and reliability performance of optoelectronic packaging. To overcome these challenges, a wide range of analysis and expertise for integrated optoelectronics, thermal and power management should be done.
Traditionally, each optoelectronic technology has followed their own packaging roadmaps, technologies, design rules and standards (eg. PIC (Photonic IC), VCSELs, MEMS based sensors, LEDs, etc.). This workshop will explore common challenges between different photonic technologies as well as bring together the entire value chain in order to identify the current bottlenecks and the ways to circumvent them.
Don’t miss this opportunity to hear from and network with experts, share thinking with peers and meet our Exhibitors from the Packaging Supply Chain at the co-located exhibition.
This unique Conference, is jointly organised by:
IMAPS (International Microelectronics, Assembly and Packaging Society, UK Chapter)
JEMI UK (Joint Equipment Materials Initiative)
EPIC (European Photonics Industry Consortium)
SEMI (Semiconductor Equipment and Materials International).
For further details please go to: