20th March 2014, Clare College, Cambridge, UK
This was an international conference covering the recent advances in manufacturing techniques and materials for printed electronics. There was a specific focus on making the transition from ‘lab to fab' and integrating devices into a final product. This conference was co-located with the 3rd plenary meeting of IEC TC119 (Printed Electronics); the standards committee which is a global effort to provide the technical foundation for the printed electronics industry.
With just under 150 delegates, from around the world, in attendance the Manufacturing for Printed Electronics Conference was one of the largest gatherings of its kind in the UK.
Delegates were treated to range of presentations across a broad range of topics related to printed electronics including; materials, fabrication technologies, vacuum deposition, metrology and applications.Keynote speakers from the National Centre for Printable Electronics from the Centre for Process Innovation and market research experts IDTechEx gave a great insight into what is happening in the UK and the world in this exciting field.
To download a pdf of the presentations please click on the links in the conference programme below.
For details regarding this, and future, events send an email to: firstname.lastname@example.org
|09.30||Welcome and Overview|
KEYNOTE: National Centre for Printable Electronics, Centre for Process Innovation
Dr. Tom Taylor
|SESSION 1: Materials|
Towards integration of solution processable OTFTs into Flexible Electronics
Dr. Irina Afonina, Merck Chemicals
Applications of low cost copper inks to high volume biosensor applications
Dr. Aaron Chan, Intrinsiq Materials
Droplet Flow Reactors for the Scalable Production of Semiconducting Polymers
James Bannock, Imperial College London
|11.00||Poster Session, Exhibition & Refreshments|
|SESSION 2: Fabrication Technologies|
Roll-to-roll manufacturing of electronic devices on thin flexible glass
Helios Chan, M-Solv Ltd.
Optimization of Manufacturing Scale Photonic Curing of Conductive Inks
Andrew Edd, Novacentrix
Technology transfer from Sheet-to-Sheet to Roll-to-Roll processing for industrial scale Printed Electronics manufacturing
Pit Teunissen, Holst-TNO
|12.30||Lunch, Poster Session & Exhibition|
Printed Electronics Markets, Technologies and Trends
|SESSION 3: Vacuum Deposition & Metrology|
Fabrication and Stability of Vacuum deposited OTFTs
Ziqian Ding, Oxford University
Non-contact motion in vacuum for OLED deposition processes
Jan van Gerwen, Bosch Rexroth
Surface metrology challenges for printed electronics
Dr. Chris Jones, National Physical Laboratory
|15.20||Poster Session, Exhibition & Refreshments|
|SESSION 4: Applications|
Gas Sensors on Printed Polymeric Micro-hotplates
Dr. Ehsan Danesh, Manchester University
A functional integrated plastic system
Antony Sou, Cambridge University
Flexible insoles preparation with inkjet printing technology and pressure sensors as a part of acoustic gait analysis
Dr. Thomas Knieling, Fraunhofer-ISIT