Manufacturing for Printed Electronics Conference 2014

20th March 2014, Clare College, Cambridge, UK



This was an international conference covering the recent advances in manufacturing techniques and materials for printed electronics. There was a specific focus on making the transition from ‘lab to fab' and integrating devices into a final product. This conference was co-located with the 3rd plenary meeting of IEC TC119 (Printed Electronics); the standards committee which is a global effort to provide the technical foundation for the printed electronics industry.


With just under 150 delegates, from around the world, in attendance the Manufacturing for Printed Electronics Conference was one of the largest gatherings of its kind in the UK.


Delegates were treated to range of presentations across a broad range of topics related to printed electronics including; materials, fabrication technologies, vacuum deposition, metrology and applications.Keynote speakers from the National Centre for Printable Electronics from the Centre for Process Innovation and market research experts IDTechEx gave a great insight into what is happening in the UK and the world in this exciting field.


To download a pdf of the presentations please click on the links in the conference programme below.

Dinner in the Great HallIn the packed Riley AuditoriumNetworking

For details regarding this, and future, events send an email to:


Conference Programme:

08.30 Registration
09.30 Welcome and Overview
09.40 KEYNOTE: National Centre for Printable Electronics, Centre for Process Innovation
Dr. Tom Taylor
  SESSION 1: Materials
10.00 Towards integration of solution processable OTFTs into Flexible Electronics
Dr. Irina Afonina, Merck Chemicals
10.20 Applications of low cost copper inks to high volume biosensor applications
Dr. Aaron Chan, Intrinsiq Materials
10.40 Droplet Flow Reactors for the Scalable Production of Semiconducting Polymers
James Bannock, Imperial College London
11.00 Poster Session, Exhibition & Refreshments
  SESSION 2: Fabrication Technologies
11.30 Roll-to-roll manufacturing of electronic devices on thin flexible glass
Helios Chan, M-Solv Ltd.
11.50 Optimization of Manufacturing Scale Photonic Curing of Conductive Inks
Andrew Edd, Novacentrix
12.10 Technology transfer from Sheet-to-Sheet to Roll-to-Roll processing for industrial scale Printed Electronics manufacturing
Pit Teunissen, Holst-TNO
12.30 Lunch, Poster Session & Exhibition


Printed Electronics Markets, Technologies and Trends
Raghu Das, CEO, IDTechEx

  SESSION 3: Vacuum Deposition & Metrology
14.20 Fabrication and Stability of Vacuum deposited OTFTs
Ziqian Ding, Oxford University
14.40 Non-contact motion in vacuum for OLED deposition processes
Jan van Gerwen, Bosch Rexroth
15.00 Surface metrology challenges for printed electronics
Dr. Chris Jones, National Physical Laboratory
15.20 Poster Session, Exhibition & Refreshments
  SESSION 4: Applications
15.50 Gas Sensors on Printed Polymeric Micro-hotplates
Dr. Ehsan Danesh, Manchester University
16.10 A functional integrated plastic system
Antony Sou, Cambridge University
16.30 Flexible insoles preparation with inkjet printing technology and pressure sensors as a part of acoustic gait analysis
Dr. Thomas Knieling, Fraunhofer-ISIT
16.50 Wrap-up
17.30 Close


Supporting Organisations