KTN's online platform helps you to make the connections you need


The Knowledge Transfer Network (KTN) has refreshed its online platform to intelligently connect you to relevant events, funding, thought pieces and specialist staff to help your business innovate and grow.

You can discover content using your area of interest, from Electronics, Sensors, Photonics to transport; from space to health – all major UK economic sectors are covered. Once you have selected your interests, using our intelligent tagging system, we will then display rich and relevant content related to your area, often from surprising sources.

An example might be new satellite technology from the space sector that is applicable in the agri-food sector. KTN-UK.co.uk will help you form these unusual and valuable connections.

All content on the platform has been carefully curated by our team of innovation specialists – not by an automated algorithm – so you can be confident that KTN is connecting you to the most relevant cutting-edge information.


The move also marks a closer alignment with our main funder, Innovate UK , with the website branding making a clear visual link. Knowledge Transfer Network is Innovate UK's innovation network partner, and also works with other funders to provide innovation networking services and fulfil our mission to drive UK growth.

We link new ideas and opportunities with expertise, markets and finance through our network of businesses, universities, funders and investors. From agri-food to autonomous systems and from energy to design, KTN combines expertise in all sectors with the ability to cross boundaries. Connecting with KTN can lead to potential partners, horizon-expanding events and innovation insights relevant to your needs.

Visit our people pages to connect directly with expertise in your sector.

Visit the KTN refreshed online platfom here


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Embedded Device Technology Meeting

Electronic Systems increasingly lie at the heart of the infrastructure and applications we take for granted in everyday life. From mobile phones and tablets through to connected autonomous vehicles, medical devices, renewable energy controllers and many more. Many of these applications require increased levels of integration and miniaturisation which has traditionally come from "die shrink" (Moores Law) and package integration (MCM, POP ..etc). Embedded Die Technology (EDT) provides an opportunity for high levels of integration at competitive price as alternative to technology such as 2.5D TSV. EDT in particular offers considerable benefits such as high I/O density, multi-die, small footprint and flexible routing.


IMAPS UK in partnership with NMI are delighted to announce this UK first premier Conference on EDT technology which will offer those involved with placement of die and components within the PCB and those involved with Die Package and Interconnection technologies, an opportunity to learn about EDT Technology, Process tools and flows, Materials selection / options, Design - Industrialisation and applications that are being enabled by EDT technology.


Don’t miss this opportunity to hear from and network with experts, share thinking with peers and meet our Exhibitors from the Packaging Supply Chain at the co-located exhibition.


This Unique Conference, organised by IMAPS-UK and NMI, being held within the Mitel Facility is your opportunity to learn about this new rapidly emerging technology approach which is offering cost effective solutions for electronic systems and applications. More details can be found here.

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